AS-One 100 / 150


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Detail Specification

4-inch (100 mm) and 6-inch (150 mm) wafer capability

Floor standing system for reduced footprint

High reliability and low cost of ownership

Vacuum capability and gas controlled process atmosphere

The stainless steel cold wall chamber technology provides high process reproducibility, ultra clean and contamination-free environment, as well as high cooling rates and low memory effect

Pyrometer and thermocouple associated with state of the art fast digital PID temperature controller provide accurate temperature control from low to high temperature range.

Edge pyrometer viewport insures enhanced temperature control of the susceptor for compound semiconductors and small samples.

Outstanding technical and process support to our customers




• RTA (Rapid Thermal Annealing)

• RTO (Rapid Thermal Oxidation)

• Contact annealing

• Implant annealing

• CVD of graphene

• CVD of carbon nanotubes

• Selenization, sulfurization

• Crystallization and densification







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